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HLMP-LB11/HLMP-LM11
4 mm Precision Optical Performance InGaN Standard Oval LED Lamps
Data Sheet
Description
These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that this device is excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. This lamp has very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used in this lamp: Indium Gallium Nitride for Blue and Green. Each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both UV-a and UV-b inhibitors to reduce the effects of long term exposure to direct sunlight.
Features
* Well defined spatial radiation pattern * High brightness material - Blue InGaN 470 nm - Green InGaN 525 nm
Applications
* Full color signs * Commercial outdoor advertising
Benefits
* Viewing angle designed for wide field of view applications * Superior performance for outdoor environments
CAUTION: Devises are Class I ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
9.80 0.18 (0.386 0.007)
3.70 0.20 (0.146 0.008)
6.30 0.20 (0.248 0.008)
21.00 MIN. (0.827) 1.00 MIN. (0.039) 1.25 0.20 (0.049 0.008) CATHODE LEAD 2.54 0.30 (0.100 0.012) 0.80 MAX. EPOXY MENISCUS (0.016) +0.10 0.40 -0 +0.004 (0.016 -0.000)
+0.10 0.45 -0.04 +0.004 (0.018 -0.002)
NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE 0.1 mm UNLESS OTHERWISE NOTED.
Device Selection Guide
Part Number HLMP-LB11-FJ0xx HLMP-LB11-HJCxx HLMP-LB11-HL0xx HLMP-LB11-JKCxx HLMP-LB11-KN0xx HLMP-LM11-LP0XX HLMP-LM11-MNCxx HLMP-LM11-NR0xx HLMP-LM11-PQCxx HLMP-LM11-QRCxx HLMP-LM11-QT0xx Color and Dominant Wavelength d (nm) Typ. Blue 470 Blue 470 Blue 470 Blue 470 Blue 470 Green 525 Green 525 Green 525 Green 525 Green 525 Green 525 Luminous Intensity Iv (mcd) at 20 mA Min. 110 180 180 240 310 400 520 680 880 1150 1150 Luminous Intensity Iv (mcd) at 20 mA Max. 310 310 520 400 880 1150 880 1900 1500 1900 3200 Tinting Type Blue Blue Blue Blue Blue Green Green Green Green Green Green
Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, d, is derived from the Chromaticity Diagram and represents the color of the lamp. 4. Tolerance for intensity limit is 15%.
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Part Numbering System
HLMP-X X 11 - X X X XX Mechanical Options 00: Bulk Packaging DD: Ammo Pack ZZ: Flexi-bin, Ammo Pack Color Bin Selections 0: No color bin limitation Maximum Intensity Bin 0: No Iv bin limitation Minimum Intensity Bin Refer to Device Selection Guide Color B: 470 nm Blue M: 525 nm Green Package L: 4 mm Standard Oval
Absolute Maximum Ratings at TA = 25C
Parameter DC Forward Current[1] Peak Pulsed Forward Current[2] Power Dissipation Reverse Voltage LED Junction Temperature Operating Temperature Range Storage Temperature Range
Notes: 1. Derate linearly as shown in Figure 3. 2. Duty Factor 10%, Frequency 1 kHz.
Value 30 mA 100 mA 130 mW 5 V (IR = 10 A) 130C -40C to +80C -40C to +100C
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Electrical /Optical Characteristics Table TA = 25C
Parameter Forward Voltage Blue (d = 470 nm) Green (d = 525 nm) Reverse Voltage Capacitance Blue (d = 470 nm) Green (d = 525 nm) Thermal Resistance Peak Wavelength Blue (d = 470 nm) Green (d = 525 nm) Spectral Halfwidth Blue (d = 470 nm) Green (d = 525 nm) Luminous Efficacy Blue (d = 470 nm) Green (d = 525 nm) Symbol VF VR C RJ-PIN P 5 43 43 240 467 520 24 35 75 520 Min. Typ. 3.8 3.8 Max. 4.0 4.0 Units V V pF C/W nm Test Conditions IF = 20 mA IR = 10 A VF = 0, f = 1 MHz LED Junction-to-Cathode Lead Peak of Wavelength of Spectral Distribution at IF = 20 mA Wavelength Width at Spectral Distribution Power Point at IF = 20 mA Emitted luminous power/Emitted radiant power
1/2
nm
v
lm/W
Notes: 1. 21/2 is the off-axis angle where the luminous intensity is 1/2 the on axis intensity. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/v where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt.
1.0
RELATIVE LUMINOUS INTENSITY
BLUE 0.8
GREEN
0.6
0.4
0.2 0
400
450
500
550 WAVELENGTH - nm
600
650
700
Figure 1. Relative intensity vs. wavelength.
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1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30
MAXIMUM FORWARD CURRENT - mA
1.4
RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
35 30 25 RJA = 780C/W 20 15 10 5 0 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE - C RJA = 585C/W
FORWARD CURRENT - mA
Figure 2. Relative luminous intensity vs. forward current.
Figure 3. Forward current vs. ambient temperature.
RELATIVE DOMINANT WAVELENGTH
30
FORWARD CURRENT - mA
1.035 1.030 1.025 1.020 1.015 1.010 1.005 1.000 0.995 0.990 0.985 0 5 10 15 20 25 30 BLUE GREEN
25 20 15 10 5 0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 FORWARD VOLTAGE - V
FORWARD CURRENT - mA
Figure 4. Forward current vs. forward voltage.
Figure 5. Relative dominant wavelength vs. forward current.
1.0
RELATIVE INTENSITY
0.5
0 -90
-70
-50
-30
-10
10
30
50
70
90
ANGLE - DEGREES
Figure 6. Spatial radiation pattern - minor axis.
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1.0
RELATIVE INTENSITY
0.5
0 -90
-70
-50
-30
-10
10
30
50
70
90
ANGLE - DEGREES
Figure 7. Spatial radiation pattern - major axis.
Intensity Bin Limits (mcd @ 20 mA)
Bin Name F G H J K L M N P Q R Min. 110 140 180 240 310 400 520 680 880 1150 1500 Max. 140 180 240 310 400 520 680 880 1150 1500 1900
Color Bin Limits (nm at 20 mA)
Blue Bin 1 2 3 4 5 Color Range (nm) Min. 460.0 464.0 468.0 472.0 476.0 Max. 464.0 468.0 472.0 476.0 480.0 Green Bin 1 2 3 4 5 Color Range (nm) Min. 520.0 524.0 528.0 532.0 536.0 Max. 524.0 528.0 532.0 536.0 540.0
Tolerance for each bin limit is 0.5 nm.
Tolerance for each bin limit is 0.5 nm.
Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories.
Tolerance for each intensity bin limit is 15%.
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Precautions: Lead Forming
* The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation.
* Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25C, before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. * Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch)
Soldering Conditions
* Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering conditions: Wave Soldering Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time 105 C Max. 30 sec Max. 250 C Max. 3 sec Max. Manual Solder Dipping - - 260 C Max. 5 sec Max.
Note: Refer to application note AN1027 for more information on soldering LED components.
TURBULENT WAVE
250
LAMINAR WAVE HOT AIR KNIFE
BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD
TEMPERATURE - C
200 150
FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE.
100 50 30 0 10
PREHEAT
20
30
40
50
60
70
80
90
100
TIME - SECONDS
Figure 8. Recommended wave soldering profile.
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For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2807EN 5989-4144EN May 31, 2006

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